Table B-1 lists the specifications for the VME Sync board.
Table B-1. VME Sync Board Specifications
Parameter | Specifications |
|---|---|
Dimensions (height x width x depth) | 15.7 in x 14.4 in. x .68 in. (400 mm x 367 mm x 15.7mm)[a] |
Environmental |
|
Storage Temperature | -40 to 85 degrees C |
Operating Temperature | 0 to 70 degrees C (at board surface) |
Relative Humidity | 0 to 95% (noncondensing). |
Power | +5V +/- 5% at 4.5A typical +/-12V +/-5% at 400 mA typical (without LIM modules) |
Agency |
|
VMEbus | IEEE 1014-87 compliance |
MTBF | Approximately 50,000 hours[b] |
[a] This board complies with the VME specification for a 9U board [b] Predictions are based on MIL-HDBK-217E part stress analysis method and assumes an ambient temperature of 55 degrees (C). | |
 | Caution: The board(s) should be brought to operating temperature in a noncondensing environment. The rate of change in the ambient air temperature should not exceed 2 degrees (C) per minute. |